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1 2 3 ARTICLE IN PRESS 4 5 6 234567891011121314162229353637 384243 International Journal of Machine Tools & Manufacture XX (2003) XXX–XXX 4748 49 50 Fine grinding of silicon wafers: a mathematical model for grinding 51 marks 52 S. Chidambaram a, Z.J. Pei a,∗, S. Kassir b 53 a Department of Industrial and Manufacturing Systems Engineering, Kansas State University, 237 …read more
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